ONE OF THE MAIN SOURCE FOR RECYCLING OF GOLD ARE motherboard from home computers, mobile devices, and the like. NEARLY EVERY MAJOR CONTACT contain certain percentage of gold. TO PITCH becomes better and with less Malfunction on its surface coating layers SE electroplating gold.
Compounds which contain in them a certain amount of gold are: IDE connectors, PCI slots, PCIEx slots, AGP, ISA and similar grooves. In addition to these we have stated gold contain memory slots, slots for processors and the like.
In fact, gold can be found in almost every important junction of an electronic circuit. To make components work smoothly each contact is coated with a layer of gold.
It is important to note that the gold price because of its values is used in small quantities, and that in the recycling of electronic waste should primarily be based on the separation of parts. Before recycling processes all parts containing gold should be removed from the other elements, such as plastics, sheet metal and similar materials from which the components are assembled.
Separation of components is essential because the gold is recycled using acids so it is very important to isolate the possible contaminants solutions that serve as a solvent for gold. Later, we will write that there are methods to dissolve gold from the surface of another metal.
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